Aries Electronics - 18-8670-610C

KEY Part #: K3357077

18-8670-610C Bei (USD) [9853pcs Hisa]

  • 1 pcs$4.20360
  • 10 pcs$4.18268

Nambari ya Sehemu:
18-8670-610C
Mzalishaji:
Aries Electronics
Maelezo ya kina:
CONN IC DIP SOCKET 18POS GOLD. IC & Component Sockets ELEV. SCKT .3 CENTER COLLET 18 PINS
Manufacturer's standard lead time:
Katika hisa
Maisha ya rafu:
Mwaka mmoja
Chip Kutoka:
Hong Kong
RoHS:
Njia ya malipo:
Njia ya usafirishaji:
Jamii Jamii:
VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: D-Sub, Viunganisho vya D-Maumbo - Vifuniko, Viunganishi vya Eddi ya Kadi - Viunga vya Edgeboar, Pipa - Viungio vya Nguvu, Viunga vya LGH, Viunga vya Banana na Vidokezo - Machapisho ya Kuun, Vituo - Nyumba, buti, Vituo - Viunga vya waya Splice and Jiwe la msingi - Viwambo, fremu ...
Faida ya Ushindani:
We specialize in Aries Electronics 18-8670-610C electronic components. 18-8670-610C can be shipped within 24 hours after order. If you have any demands for 18-8670-610C, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

18-8670-610C Sifa za Bidhaa

Nambari ya Sehemu : 18-8670-610C
Mzalishaji : Aries Electronics
Maelezo : CONN IC DIP SOCKET 18POS GOLD
Mfululizo : 8
Hali ya Sehemu : Active
Chapa : DIP, 0.6" (15.24mm) Row Spacing
Idadi ya Nafasi au Pini (Gridi) : 18 (2 x 9)
Pitch - Mating : 0.100" (2.54mm)
Wasiliana Nimalize - Mating : Gold
Wasiliana na Maliza Kukomesha - Mating : 30.0µin (0.76µm)
Wasiliana na Nyenzo - Mating : Beryllium Copper
Aina ya Kuinua : Through Hole
Vipengele : Closed Frame, Elevated
Kukomesha : Solder
Shimo - Chapisho : 0.100" (2.54mm)
Wasiliana na Maliza - Chapisha : Gold
Wasiliana na Maliza Kukomesha - Tuma : 10.0µin (0.25µm)
Nyenzo ya Mawasiliano - Chapisha : Brass
Nyenzo ya Nyumba : Polyamide (PA46), Nylon 4/6, Glass Filled
Joto la Kufanya kazi : -55°C ~ 105°C
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