[13656pcs Hisa]
- Nambari ya Sehemu:
- DIP316-014BLF
- Mzalishaji:
- Amphenol ICC (FCI)
- Maelezo ya kina:
- CONN IC DIP SOCKET 16POS TIN.
- Manufacturer's standard lead time:
- Katika hisa
- Maisha ya rafu:
- Mwaka mmoja
- Chip Kutoka:
- Hong Kong
- RoHS:
- Njia ya malipo:
-
- Njia ya usafirishaji:
- Jamii Jamii:
- VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Vituo - Viunganishi vya kisu, Vituo - Solder Lug Viunga, D-Sub, Viunganisho vya D-Maumbo - Vifuniko, Viungio vya Uingilio wa Nguvu - Vidonge, Soketi kwa ICs, Transistors - Vifuniko, Viunganisho vya Kuunganika - Bodi In, moja kwa moj, Viunga vya Banana na Vidokezo - Machapisho ya Kuun and Vituo - Vyaunganisha foil ...
- Faida ya Ushindani:
- We specialize in Amphenol ICC (FCI) DIP316-014BLF electronic components. DIP316-014BLF can be shipped within 24 hours after order. If you have any demands for DIP316-014BLF, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
DIP316-014BLF Sifa za Bidhaa
Nambari ya Sehemu :
DIP316-014BLF
Mzalishaji :
Amphenol ICC (FCI)
Maelezo :
CONN IC DIP SOCKET 16POS TIN
Mfululizo :
-
Hali ya Sehemu :
Obsolete
Chapa :
DIP, 0.3" (7.62mm) Row Spacing
Idadi ya Nafasi au Pini (Gridi) :
16 (2 x 8)
Pitch - Mating :
0.100" (2.54mm)
Wasiliana Nimalize - Mating :
Tin
Wasiliana na Maliza Kukomesha - Mating :
100.0µin (2.54µm)
Wasiliana na Nyenzo - Mating :
Beryllium Copper
Aina ya Kuinua :
Through Hole
Vipengele :
Open Frame
Kukomesha :
Solder
Shimo - Chapisho :
0.100" (2.54mm)
Wasiliana na Maliza - Chapisha :
Tin
Wasiliana na Maliza Kukomesha - Tuma :
200.0µin (5.08µm)
Nyenzo ya Mawasiliano - Chapisha :
Brass
Nyenzo ya Nyumba :
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Joto la Kufanya kazi :
-
Habari mpya kabisa
Unaweza pia Kuvutiwa Na
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