t-Global Technology - H48-6G-7.2-4.8-3

KEY Part #: K6153051

H48-6G-7.2-4.8-3 Bei (USD) [77933pcs Hisa]

  • 1 pcs$0.50172
  • 10 pcs$0.47747
  • 25 pcs$0.46493
  • 50 pcs$0.45238
  • 100 pcs$0.42726
  • 250 pcs$0.40213
  • 500 pcs$0.37699
  • 1,000 pcs$0.33284
  • 5,000 pcs$0.32095

Nambari ya Sehemu:
H48-6G-7.2-4.8-3
Mzalishaji:
t-Global Technology
Maelezo ya kina:
THERM PAD 4.80MMX7.20MM GRAY.
Manufacturer's standard lead time:
Katika hisa
Maisha ya rafu:
Mwaka mmoja
Chip Kutoka:
Hong Kong
RoHS:
Njia ya malipo:
Njia ya usafirishaji:
Jamii Jamii:
VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Mashabiki wa AC, Mafuta - baridi ya vinywaji, Mafuta - Pedi, Karatasi, Mafuta - Mabomba ya joto, Chumba cha Vapor, Mashabiki wa DC, Thermal - Adhesives, Mioyo, Grisi, ladha, Mashabiki - Vifaa and Thermal - Adhesives, Mioyo, Grisi, ladha ...
Faida ya Ushindani:
We specialize in t-Global Technology H48-6G-7.2-4.8-3 electronic components. H48-6G-7.2-4.8-3 can be shipped within 24 hours after order. If you have any demands for H48-6G-7.2-4.8-3, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

H48-6G-7.2-4.8-3 Sifa za Bidhaa

Nambari ya Sehemu : H48-6G-7.2-4.8-3
Mzalishaji : t-Global Technology
Maelezo : THERM PAD 4.80MMX7.20MM GRAY
Mfululizo : H48-6G
Hali ya Sehemu : Active
Matumizi : -
Chapa : Conductive Pad, Sheet
Sura : Rectangular
Muhtasari : 4.80mm x 7.20mm
Unene : 0.118" (3.00mm)
Nyenzo : Silicone Elastomer
Adhesive : -
Kuunga mkono, Mtoaji : -
Rangi : Gray
Resisization ya mafuta : -
Hali ya Mafuta : 6.0 W/m-K

Unaweza pia Kuvutiwa Na
  • PL-2-3-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Green

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-220

    Wakefield-Vette

    THERM PAD 17.78MMX12.7MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, 0.003 Inch Thick

  • CD-02-05-220-N

    Wakefield-Vette

    THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole

  • CD-02-05-247-N

    Wakefield-Vette

    THERM PAD TO-247 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-247 Pad, No Hole

  • CD-02-05-025

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, 1 Inch x 1 Inch Square Pad, 0.003 Inch Thick