Laird Technologies - Thermal Materials - A14950-18

KEY Part #: K6153050

A14950-18 Bei (USD) [627pcs Hisa]

  • 1 pcs$74.36161
  • 3 pcs$73.99165

Nambari ya Sehemu:
A14950-18
Mzalishaji:
Laird Technologies - Thermal Materials
Maelezo ya kina:
THERM PAD 228.6MMX228.6MM BLUE. Thermal Interface Products Tflex 5180 DC1 9x9" 2.8W/mK gap filler
Manufacturer's standard lead time:
Katika hisa
Maisha ya rafu:
Mwaka mmoja
Chip Kutoka:
Hong Kong
RoHS:
Njia ya malipo:
Njia ya usafirishaji:
Jamii Jamii:
VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Mashabiki wa AC, Mashabiki - Vifunguo - Kamba za Mashabiki, Mafuta - Thermoelectric, Model za Peltier, Mafuta - Inafuta joto, Mashabiki wa DC, Mafuta - Thermoelectric, Peltier Assemblies, Thermal - Adhesives, Mioyo, Grisi, ladha and Mafuta - Mabomba ya joto, Chumba cha Vapor ...
Faida ya Ushindani:
We specialize in Laird Technologies - Thermal Materials A14950-18 electronic components. A14950-18 can be shipped within 24 hours after order. If you have any demands for A14950-18, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

A14950-18 Sifa za Bidhaa

Nambari ya Sehemu : A14950-18
Mzalishaji : Laird Technologies - Thermal Materials
Maelezo : THERM PAD 228.6MMX228.6MM BLUE
Mfululizo : Tflex™ 500
Hali ya Sehemu : Not For New Designs
Matumizi : -
Chapa : Gap Filler Pad, Sheet
Sura : Square
Muhtasari : 228.60mm x 228.60mm
Unene : 0.180" (4.57mm)
Nyenzo : Silicone Elastomer
Adhesive : Tacky - One Side
Kuunga mkono, Mtoaji : -
Rangi : Blue
Resisization ya mafuta : -
Hali ya Mafuta : 2.8 W/m-K

Unaweza pia Kuvutiwa Na
  • PL-2-3-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Green

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-220

    Wakefield-Vette

    THERM PAD 17.78MMX12.7MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, 0.003 Inch Thick

  • CD-02-05-220-N

    Wakefield-Vette

    THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole

  • CD-02-05-247-N

    Wakefield-Vette

    THERM PAD TO-247 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-247 Pad, No Hole

  • CD-02-05-025

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, 1 Inch x 1 Inch Square Pad, 0.003 Inch Thick