[13694pcs Hisa]
- Nambari ya Sehemu:
- DIP050-628-157BLF
- Mzalishaji:
- Amphenol ICC (FCI)
- Maelezo ya kina:
- CONN IC DIP SOCKET 28POS TIN.
- Manufacturer's standard lead time:
- Katika hisa
- Maisha ya rafu:
- Mwaka mmoja
- Chip Kutoka:
- Hong Kong
- RoHS:
- Njia ya malipo:
-
- Njia ya usafirishaji:
- Jamii Jamii:
- VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Viunga vya Banana na Tip - Jacks, plugs, Soketi kwa ICs, Transistors, Viungio vya Uingilio wa Nguvu - Vidonge, Viunga vya Ushuru mzito - Nyumba, Hoods, Bases, Viunga vya Eddi ya Kadi - Adapta, Viunganisho vya D-Sub, Vituo - Viunganishi vya kisu and Vituo - Vituo ...
- Faida ya Ushindani:
- We specialize in Amphenol ICC (FCI) DIP050-628-157BLF electronic components. DIP050-628-157BLF can be shipped within 24 hours after order. If you have any demands for DIP050-628-157BLF, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
DIP050-628-157BLF Sifa za Bidhaa
Nambari ya Sehemu :
DIP050-628-157BLF
Mzalishaji :
Amphenol ICC (FCI)
Maelezo :
CONN IC DIP SOCKET 28POS TIN
Mfululizo :
-
Hali ya Sehemu :
Obsolete
Chapa :
DIP, 0.6" (15.24mm) Row Spacing
Idadi ya Nafasi au Pini (Gridi) :
28 (2 x 14)
Pitch - Mating :
0.100" (2.54mm)
Wasiliana Nimalize - Mating :
Tin
Wasiliana na Maliza Kukomesha - Mating :
100.0µin (2.54µm)
Wasiliana na Nyenzo - Mating :
Beryllium Copper
Aina ya Kuinua :
Through Hole
Vipengele :
Open Frame
Kukomesha :
Solder
Shimo - Chapisho :
0.100" (2.54mm)
Wasiliana na Maliza - Chapisha :
Tin
Wasiliana na Maliza Kukomesha - Tuma :
200.0µin (5.08µm)
Nyenzo ya Mawasiliano - Chapisha :
Brass
Nyenzo ya Nyumba :
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Joto la Kufanya kazi :
-
Habari mpya kabisa
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