76745-325-18LF Bei (USD) [107590pcs Hisa]
- 1 pcs$0.34378
- 800 pcs$0.32745
- Nambari ya Sehemu:
- 76745-325-18LF
- Mzalishaji:
- Amphenol ICC (FCI)
- Maelezo ya kina:
- CONN HDR 18POS 0.1 STACK T/H TIN. Headers & Wire Housings BERGSTIK
- Manufacturer's standard lead time:
- Katika hisa
- Maisha ya rafu:
- Mwaka mmoja
- Chip Kutoka:
- Hong Kong
- RoHS:
- Njia ya malipo:
-
- Njia ya usafirishaji:
- Jamii Jamii:
- VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Viungio vya Uingilio wa Nguvu - Vidonge, Viunganishi vya Kawaida - plugs, Vituo - Adapta, Viunganisho vya Mtaa-Spacers za Bodi, stika (Bodi , Viunganisho vinavyoweza kuvunjika - Viongezeo, Viunganishi vya Eddi ya Kadi - Viunga vya Edgeboar, Mifumo ya Jumuia la terminal and USB, DVI, Viunganishi vya HDMI - Vifuniko ...
- Faida ya Ushindani:
- We specialize in Amphenol ICC (FCI) 76745-325-18LF electronic components. 76745-325-18LF can be shipped within 24 hours after order. If you have any demands for 76745-325-18LF, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
76745-325-18LF Sifa za Bidhaa
Nambari ya Sehemu :
76745-325-18LF
Mzalishaji :
Amphenol ICC (FCI)
Maelezo :
CONN HDR 18POS 0.1 STACK T/H TIN
Mfululizo :
BERGSTIK® II, MezzSelect™, Basics+
Hali ya Sehemu :
Active
Idadi ya Nafasi :
18
Shimo :
0.100" (2.54mm)
Idadi ya safu :
2
Nafasi za safu :
0.100" (2.54mm)
Urefu - Jumla ya Pini :
1.225" (31.115mm)
Urefu - Chapisho (Mating) :
0.388" (9.855mm)
Urefu - Urefu wa Stack :
0.450" (11.430mm)
Urefu - Mkia :
0.388" (9.855mm)
Aina ya Kuinua :
Through Hole
Kukomesha :
Solder
Wasiliana na Maliza - Chapisha (Mating) :
Tin
Wasiliana na Maliza Kukomesha - Tuma (Matana) :
78.7µin (2.00µm)
Rangi :
Black
Habari mpya kabisa
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