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Ikiwa eneo lako halijaorodheshwa, tafadhali chagua moja ya yafuatayo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Nyumbani
  2. Bidhaa
  3. Viungio, Viunganisho
  4. Soketi kwa ICs, Transistors
  5. 558-10-357M19-001101

Preci-Dip - 558-10-357M19-001101

KEY Part #: K3342601

558-10-357M19-001101 Bei (USD) [870pcs Hisa]

  • 1 pcs$53.68579
  • 21 pcs$53.41870
Nambari ya Sehemu:
558-10-357M19-001101
Mzalishaji:
Preci-Dip
Maelezo ya kina:
PGA SOLDER TAIL 1.27MM.
Manufacturer's standard lead time:
Katika hisa
Maisha ya rafu:
Mwaka mmoja
Chip Kutoka:
Hong Kong
RoHS:
Njia ya malipo:
Njia ya usafirishaji:
Jamii Jamii:
VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Viunga vya Nguvu za Aina ya Blade - Nyumba, Viunga vya Ushuru mzito - Assemblies, Viunganisho vya Kuunganika - Bodi In, moja kwa moj, Jiwe la msingi - Ingiza, Vituo - Solder Lug Viunga, Viungio vya Optic ya Fibre, Viunganisho vinavyoonekana - Spring Iliyopakiwa and Viunganishi vya Eddi ya Kadi - Vituo ...
Faida ya Ushindani:
We specialize in Preci-Dip 558-10-357M19-001101 electronic components. 558-10-357M19-001101 can be shipped within 24 hours after order. If you have any demands for 558-10-357M19-001101, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

558-10-357M19-001101 Sifa za Bidhaa

Nambari ya Sehemu : 558-10-357M19-001101
Mzalishaji : Preci-Dip
Maelezo : PGA SOLDER TAIL 1.27MM
Mfululizo : 558
Hali ya Sehemu : Active
Chapa : PGA
Idadi ya Nafasi au Pini (Gridi) : 357 (19 x 19)
Pitch - Mating : 0.050" (1.27mm)
Wasiliana Nimalize - Mating : Gold
Wasiliana na Maliza Kukomesha - Mating : 10.0µin (0.25µm)
Wasiliana na Nyenzo - Mating : Beryllium Copper
Aina ya Kuinua : Through Hole
Vipengele : Closed Frame
Kukomesha : Solder
Shimo - Chapisho : 0.050" (1.27mm)
Wasiliana na Maliza - Chapisha : Gold
Wasiliana na Maliza Kukomesha - Tuma : 10.0µin (0.25µm)
Nyenzo ya Mawasiliano - Chapisha : Brass
Nyenzo ya Nyumba : FR4 Epoxy Glass
Joto la Kufanya kazi : -55°C ~ 125°C
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