ESW-103-23-G-S-01 Bei (USD) [57728pcs Hisa]
- 1 pcs$0.67732
- Nambari ya Sehemu:
- ESW-103-23-G-S-01
- Mzalishaji:
- Samtec Inc.
- Maelezo ya kina:
- CONN SOCKET 3POS 0.1 GOLD PCB.
- Manufacturer's standard lead time:
- Katika hisa
- Maisha ya rafu:
- Mwaka mmoja
- Chip Kutoka:
- Hong Kong
- RoHS:
- Njia ya malipo:
-
- Njia ya usafirishaji:
- Jamii Jamii:
- VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Vitalu vya terminal - Jopo la Jopo, Vitalu vya terminal - Vizuizi Vizuizi, Viunganisho vya kuvutia - Vichwa, Pini maalum, USB, DVI, Viunganishi vya HDMI - Vifuniko, Viunganisho vya kuvutia - Anwani, Viunganishi vya FFC, FPC (Flat Flexible) - Vifunik, Viunganisho vya kuvutia - Kunyongwa Bure, Mlima wa and Vituo - Viunganishi vya Screw ...
- Faida ya Ushindani:
- We specialize in Samtec Inc. ESW-103-23-G-S-01 electronic components. ESW-103-23-G-S-01 can be shipped within 24 hours after order. If you have any demands for ESW-103-23-G-S-01, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
ESW-103-23-G-S-01 Sifa za Bidhaa
Nambari ya Sehemu :
ESW-103-23-G-S-01
Mzalishaji :
Samtec Inc.
Maelezo :
CONN SOCKET 3POS 0.1 GOLD PCB
Mfululizo :
ESW
Hali ya Sehemu :
Active
Aina ya kiunganishi :
Elevated Socket
Aina ya Mawasiliano :
Forked
Mtindo :
Board to Board
Idadi ya Nafasi :
3
Idadi ya Nafasi Zilizopakiwa :
2
Pitch - Mating :
0.100" (2.54mm)
Idadi ya safu :
1
Nafasi za Kuweka safu - Mating :
-
Aina ya Kuinua :
Through Hole
Kukomesha :
Solder
Aina ya kufunga :
Push-Pull
Wasiliana Nimalize - Mating :
Gold
Wasiliana na Maliza Kukomesha - Mating :
20.0µin (0.51µm)
Rangi ya insulation :
Black
Urefu wa insulation :
0.535" (13.60mm)
Urefu wa Mawasiliano - Chapisho :
0.190" (4.83mm)
Joto la Kufanya kazi :
-55°C ~ 125°C
Ukosefu wa nguvu wa nyenzo :
UL94 V-0
Wasiliana na Maliza - Chapisha :
Gold
Urefu wa Kuingiliana kwa urefu :
-
Ulinzi wa Ingress :
-
Vipengele :
-
Ukadiriaji wa sasa :
5.2A per Contact
Upimaji wa Voltage :
550VAC
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