Nambari ya Sehemu :
TS391SNL
Mzalishaji :
Chip Quik Inc.
Maelezo :
THERMALLY STABLE SOLDER PASTE NO
Muundo :
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Kiwango cha kuyeyuka :
423 ~ 428°F (217 ~ 220°C)
Fomu :
Syringe, 0.53 oz (15g), 5cc
Maisha ya rafu :
12 Months
Kuanza Maisha ya Rafu :
Date of Manufacture
Joto la Kuhifadhi / Jokofu :
68°F ~ 77°F (20°C ~ 25°C)