Nambari ya Sehemu :
BDN12-5CB/A01
Mzalishaji :
CTS Thermal Management Products
Maelezo :
HEATSINK CPU W/ADHESIVE 1.21SQ
Kifurushi kilichopozwa :
Assorted (BGA, LGA, CPU, ASIC...)
Njia ya Kiambatisho :
Thermal Tape, Adhesive (Included)
Urefu Mbali Msingi (Urefu wa Fin) :
0.555" (14.10mm)
Uondoaji wa Nguvu @ Joto la joto :
-
Upinzani wa mafuta @ Uliyolazimishwa Kutoka Hewa :
5.20°C/W @ 400 LFM
Upinzani wa mafuta @ Asili :
16.50°C/W
Maliza ya Maliza :
Black Anodized