Amphenol ICC (FCI) - DIP306-001BLF

KEY Part #: K3351231

[5648pcs Hisa]


    Nambari ya Sehemu:
    DIP306-001BLF
    Mzalishaji:
    Amphenol ICC (FCI)
    Maelezo ya kina:
    CONN IC DIP SOCKET 6POS GOLD.
    Manufacturer's standard lead time:
    Katika hisa
    Maisha ya rafu:
    Mwaka mmoja
    Chip Kutoka:
    Hong Kong
    RoHS:
    Njia ya malipo:
    Njia ya usafirishaji:
    Jamii Jamii:
    VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Pipa - Viungio vya Nguvu, Viungio vya mviringo - Anwani, Anwani - leadframe, Viungio vya mviringo, Vituo - Vinjari vya Turret, Vitalu vya terminal - Jopo la Jopo, Viungio vya Uingilio wa Nguvu - Vidonge and Viunganisho vya kuvutia - Nyumba ...
    Faida ya Ushindani:
    We specialize in Amphenol ICC (FCI) DIP306-001BLF electronic components. DIP306-001BLF can be shipped within 24 hours after order. If you have any demands for DIP306-001BLF, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    DIP306-001BLF Sifa za Bidhaa

    Nambari ya Sehemu : DIP306-001BLF
    Mzalishaji : Amphenol ICC (FCI)
    Maelezo : CONN IC DIP SOCKET 6POS GOLD
    Mfululizo : -
    Hali ya Sehemu : Obsolete
    Chapa : DIP, 0.3" (7.62mm) Row Spacing
    Idadi ya Nafasi au Pini (Gridi) : 6 (2 x 3)
    Pitch - Mating : 0.100" (2.54mm)
    Wasiliana Nimalize - Mating : Gold
    Wasiliana na Maliza Kukomesha - Mating : 30.0µin (0.76µm)
    Wasiliana na Nyenzo - Mating : Beryllium Copper
    Aina ya Kuinua : Through Hole
    Vipengele : Open Frame
    Kukomesha : Solder
    Shimo - Chapisho : 0.100" (2.54mm)
    Wasiliana na Maliza - Chapisha : Tin
    Wasiliana na Maliza Kukomesha - Tuma : 200.0µin (5.08µm)
    Nyenzo ya Mawasiliano - Chapisha : Brass
    Nyenzo ya Nyumba : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
    Joto la Kufanya kazi : -

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