[3727pcs Hisa]
- Nambari ya Sehemu:
- 2-641605-2
- Mzalishaji:
- TE Connectivity AMP Connectors
- Maelezo ya kina:
- CONN IC DIP SOCKET 28POS GOLD.
- Manufacturer's standard lead time:
- Katika hisa
- Maisha ya rafu:
- Mwaka mmoja
- Chip Kutoka:
- Hong Kong
- RoHS:
- Njia ya malipo:
-
- Njia ya usafirishaji:
- Jamii Jamii:
- VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Viunga vya Kumbukumbu - Soketi za Kadi za PC, Viungio vya mviringo - Anwani, Viunga vya Photovoltaic (Jopo la Solar) - Vifuniko, Pipa - Viungio vya Sauti, Vitalu vya terminal - Vifuniko, Vitalu vya terminal - Maalum, Vituo - Viunganishi vya Screw and Pipa - Viungio vya Nguvu ...
- Faida ya Ushindani:
- We specialize in TE Connectivity AMP Connectors 2-641605-2 electronic components. 2-641605-2 can be shipped within 24 hours after order. If you have any demands for 2-641605-2, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
2-641605-2 Sifa za Bidhaa
Nambari ya Sehemu :
2-641605-2
Mzalishaji :
TE Connectivity AMP Connectors
Maelezo :
CONN IC DIP SOCKET 28POS GOLD
Mfululizo :
Diplomate DL
Hali ya Sehemu :
Obsolete
Chapa :
DIP, 0.6" (15.24mm) Row Spacing
Idadi ya Nafasi au Pini (Gridi) :
28 (2 x 14)
Pitch - Mating :
0.100" (2.54mm)
Wasiliana Nimalize - Mating :
Gold
Wasiliana na Maliza Kukomesha - Mating :
30.0µin (0.76µm)
Wasiliana na Nyenzo - Mating :
Beryllium Copper
Aina ya Kuinua :
Through Hole
Vipengele :
Open Frame
Kukomesha :
Solder
Shimo - Chapisho :
0.100" (2.54mm)
Wasiliana na Maliza - Chapisha :
Gold
Wasiliana na Maliza Kukomesha - Tuma :
30.0µin (0.76µm)
Nyenzo ya Mawasiliano - Chapisha :
Beryllium Copper
Nyenzo ya Nyumba :
Thermoplastic, Glass Filled
Joto la Kufanya kazi :
-55°C ~ 125°C
Habari mpya kabisa
Unaweza pia Kuvutiwa Na
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