Aavid, Thermal Division of Boyd Corporation - 573400D00000G

KEY Part #: K6265789

573400D00000G Bei (USD) [106274pcs Hisa]

  • 1 pcs$0.34804
  • 8,500 pcs$0.21862

Nambari ya Sehemu:
573400D00000G
Mzalishaji:
Aavid, Thermal Division of Boyd Corporation
Maelezo ya kina:
BOARD LEVEL HEAT SINK. Heat Sinks Surface Mount Stamped Heatsink for D3Pak, TO-268 for D3PAK, TO-268, Horizontal Mounting, 11 n Thermal Resistance, Bulk Packaging, 30.99mm
Manufacturer's standard lead time:
Katika hisa
Maisha ya rafu:
Mwaka mmoja
Chip Kutoka:
Hong Kong
RoHS:
Njia ya malipo:
Njia ya usafirishaji:
Jamii Jamii:
VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Mafuta - Thermoelectric, Model za Peltier, Mafuta - Pedi, Karatasi, Mafuta - Inafuta joto, Mafuta - Thermoelectric, Peltier Assemblies, Mashabiki - Vifaa, Thermal - Adhesives, Mioyo, Grisi, ladha, Mafuta - vifaa and Mashabiki wa AC ...
Faida ya Ushindani:
We specialize in Aavid, Thermal Division of Boyd Corporation 573400D00000G electronic components. 573400D00000G can be shipped within 24 hours after order. If you have any demands for 573400D00000G, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

573400D00000G Sifa za Bidhaa

Nambari ya Sehemu : 573400D00000G
Mzalishaji : Aavid, Thermal Division of Boyd Corporation
Maelezo : BOARD LEVEL HEAT SINK
Mfululizo : -
Hali ya Sehemu : Active
Chapa : Top Mount
Kifurushi kilichopozwa : TO-268 (D³Pak)
Njia ya Kiambatisho : SMD Pad
Sura : Rectangular, Fins
Urefu : 0.500" (12.70mm)
Upana : 1.220" (30.99mm)
Kipenyo : -
Urefu Mbali Msingi (Urefu wa Fin) : 0.401" (10.20mm)
Uondoaji wa Nguvu @ Joto la joto : 1.0W @ 20°C
Upinzani wa mafuta @ Uliyolazimishwa Kutoka Hewa : 4.00°C/W @ 600 LFM
Upinzani wa mafuta @ Asili : 14.00°C/W
Nyenzo : -
Maliza ya Maliza : Tin

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