Nambari ya Sehemu :
67SLG100100100PI00
Mzalishaji :
Laird Technologies EMI
Maelezo :
METAL FILM OVER FOAM CONTACTS
Mfululizo :
SMD Grounding Metallized
Nyenzo :
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Njia ya Kiambatisho :
Solder
Joto la Kufanya kazi :
-40°C ~ 70°C