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  1. Nyumbani
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  4. Iliyoingizwa - Mfumo kwenye Chip (SoC)
  5. XCZU17EG-L1FFVD1760I

Xilinx Inc. - XCZU17EG-L1FFVD1760I

KEY Part #: K1302420

[14pcs Hisa]

    Nambari ya Sehemu:
    XCZU17EG-L1FFVD1760I
    Mzalishaji:
    Xilinx Inc.
    Maelezo ya kina:
    IC FPGA 308 I/O 1760FCBGA.
    Manufacturer's standard lead time:
    Katika hisa
    Maisha ya rafu:
    Mwaka mmoja
    Chip Kutoka:
    Hong Kong
    RoHS:
    Njia ya malipo:
    Njia ya usafirishaji:
    Jamii Jamii:
    VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: PMIC - Madereva wa Laser, Linear - Usindikaji wa Video, Upataji wa data - Kidhibiti cha Skrini ya Kugusa, Maingiliano - Moduli, Saa / Saa - Maombi Maalum, Kumbukumbu, Maingiliano - CODECs and PMIC - Watawala wa Ugavi wa Nguvu, Wachunguzi ...
    Faida ya Ushindani:
    We specialize in Xilinx Inc. XCZU17EG-L1FFVD1760I electronic components. XCZU17EG-L1FFVD1760I can be shipped within 24 hours after order. If you have any demands for XCZU17EG-L1FFVD1760I, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    XCZU17EG-L1FFVD1760I Sifa za Bidhaa

    Nambari ya Sehemu : XCZU17EG-L1FFVD1760I
    Mzalishaji : Xilinx Inc.
    Maelezo : IC FPGA 308 I/O 1760FCBGA
    Mfululizo : Zynq® UltraScale+™ MPSoC EG
    Hali ya Sehemu : Active
    Usanifu : MCU, FPGA
    Mchakato wa Core : Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    Ukubwa wa Flash : -
    Saizi ya RAM : 256KB
    Mzunguko : DMA, WDT
    Uunganisho : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Kasi : 500MHz, 600MHz, 1.2GHz
    Sifa za Msingi : Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
    Joto la Kufanya kazi : -40°C ~ 100°C (TJ)
    Kifurushi / Kesi : 1760-BBGA, FCBGA
    Kifurushi cha Kifaa cha Mtoaji : 1760-FCBGA (42.5x42.5)

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