ESQ-129-13-G-D Bei (USD) [9620pcs Hisa]
- 1 pcs$4.28360
- Nambari ya Sehemu:
- ESQ-129-13-G-D
- Mzalishaji:
- Samtec Inc.
- Maelezo ya kina:
- CONN SOCKET 58POS 0.1 GOLD PCB.
- Manufacturer's standard lead time:
- Katika hisa
- Maisha ya rafu:
- Mwaka mmoja
- Chip Kutoka:
- Hong Kong
- RoHS:
- Njia ya malipo:
-
- Njia ya usafirishaji:
- Jamii Jamii:
- VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Viunga vya Backplane - DIN 41612, Vituo - Vinjari vya Turret, Viunga vya Banana na Vidokezo - Machapisho ya Kuun, Viunga vya Photovoltaic (Jopo la Solar) - Vifuniko, Vituo - Viunga vya waya vya waya, Viungio vya Optic ya Fibreti - Adapta, D-Sub, Viunganishi vya D-Maumbo - Nyumba and Vituo - Nyumba, buti ...
- Faida ya Ushindani:
- We specialize in Samtec Inc. ESQ-129-13-G-D electronic components. ESQ-129-13-G-D can be shipped within 24 hours after order. If you have any demands for ESQ-129-13-G-D, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
ESQ-129-13-G-D Sifa za Bidhaa
Nambari ya Sehemu :
ESQ-129-13-G-D
Mzalishaji :
Samtec Inc.
Maelezo :
CONN SOCKET 58POS 0.1 GOLD PCB
Mfululizo :
ESQ
Hali ya Sehemu :
Active
Aina ya kiunganishi :
Elevated Socket
Aina ya Mawasiliano :
Forked
Mtindo :
Board to Board
Idadi ya Nafasi :
58
Idadi ya Nafasi Zilizopakiwa :
All
Pitch - Mating :
0.100" (2.54mm)
Idadi ya safu :
2
Nafasi za Kuweka safu - Mating :
0.100" (2.54mm)
Aina ya Kuinua :
Through Hole
Kukomesha :
Solder
Aina ya kufunga :
Push-Pull
Wasiliana Nimalize - Mating :
Gold
Wasiliana na Maliza Kukomesha - Mating :
20.0µin (0.51µm)
Rangi ya insulation :
Black
Urefu wa insulation :
0.435" (11.05mm)
Urefu wa Mawasiliano - Chapisho :
0.290" (7.37mm)
Joto la Kufanya kazi :
-55°C ~ 125°C
Ukosefu wa nguvu wa nyenzo :
UL94 V-0
Wasiliana na Maliza - Chapisha :
Gold
Urefu wa Kuingiliana kwa urefu :
-
Ulinzi wa Ingress :
-
Vipengele :
-
Ukadiriaji wa sasa :
5.7A per Contact
Upimaji wa Voltage :
550VAC
Habari mpya kabisa
Unaweza pia Kuvutiwa Na
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