Nambari ya Sehemu :
508-AG10D
Mzalishaji :
TE Connectivity AMP Connectors
Maelezo :
CONN IC DIP SOCKET 8POS GOLD
Chapa :
DIP, 0.3" (7.62mm) Row Spacing
Idadi ya Nafasi au Pini (Gridi) :
8 (2 x 4)
Pitch - Mating :
0.100" (2.54mm)
Wasiliana Nimalize - Mating :
Gold
Wasiliana na Maliza Kukomesha - Mating :
25.0µin (0.63µm)
Wasiliana na Nyenzo - Mating :
Copper Alloy
Aina ya Kuinua :
Through Hole
Shimo - Chapisho :
0.100" (2.54mm)
Wasiliana na Maliza - Chapisha :
Gold
Wasiliana na Maliza Kukomesha - Tuma :
25.0µin (0.63µm)
Nyenzo ya Mawasiliano - Chapisha :
Copper Alloy
Joto la Kufanya kazi :
-55°C ~ 125°C