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Ikiwa eneo lako halijaorodheshwa, tafadhali chagua moja ya yafuatayo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Nyumbani
  2. Bidhaa
  3. Viungio, Viunganisho
  4. Soketi kwa ICs, Transistors
  5. 40-6554-18

Aries Electronics - 40-6554-18

KEY Part #: K3342694

40-6554-18 Bei (USD) [1020pcs Hisa]

  • 1 pcs$45.73055
  • 7 pcs$45.50303
Nambari ya Sehemu:
40-6554-18
Mzalishaji:
Aries Electronics
Maelezo ya kina:
CONN IC DIP SOCKET ZIF 40POS. IC & Component Sockets FORCE DIP TEST SCKT HIGH TEMP 40 PINS
Manufacturer's standard lead time:
Katika hisa
Maisha ya rafu:
Mwaka mmoja
Chip Kutoka:
Hong Kong
RoHS:
Njia ya malipo:
Njia ya usafirishaji:
Jamii Jamii:
VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Vituo - Vituo, Viungio vya mviringo - Vidonge, Viunga vya LGH, Viunga vya Ushuru Mzito - Mawasiliano, Viungio vya Coaxial (RF) - Vifunguo, Viunganisho vya kuvutia - Adapta, Viungio vya Coaxial (RF) - Vifuniko and Viunga vya Taa za Jimbo Mango - Mawasiliano ...
Faida ya Ushindani:
We specialize in Aries Electronics 40-6554-18 electronic components. 40-6554-18 can be shipped within 24 hours after order. If you have any demands for 40-6554-18, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

40-6554-18 Sifa za Bidhaa

Nambari ya Sehemu : 40-6554-18
Mzalishaji : Aries Electronics
Maelezo : CONN IC DIP SOCKET ZIF 40POS
Mfululizo : 55
Hali ya Sehemu : Active
Chapa : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Idadi ya Nafasi au Pini (Gridi) : 40 (2 x 20)
Pitch - Mating : 0.100" (2.54mm)
Wasiliana Nimalize - Mating : Nickel Boron
Wasiliana na Maliza Kukomesha - Mating : 50.0µin (1.27µm)
Wasiliana na Nyenzo - Mating : Beryllium Nickel
Aina ya Kuinua : Through Hole
Vipengele : Closed Frame
Kukomesha : Solder
Shimo - Chapisho : 0.100" (2.54mm)
Wasiliana na Maliza - Chapisha : Nickel Boron
Wasiliana na Maliza Kukomesha - Tuma : 50.0µin (1.27µm)
Nyenzo ya Mawasiliano - Chapisha : Beryllium Nickel
Nyenzo ya Nyumba : Polyetheretherketone (PEEK), Glass Filled
Joto la Kufanya kazi : -55°C ~ 250°C
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