Molex - 2010213266

KEY Part #: K1365816

[2314pcs Hisa]


    Nambari ya Sehemu:
    2010213266
    Mzalishaji:
    Molex
    Maelezo ya kina:
    CONN HEADER R/A 16POS 1.27MM.
    Manufacturer's standard lead time:
    Katika hisa
    Maisha ya rafu:
    Mwaka mmoja
    Chip Kutoka:
    Hong Kong
    RoHS:
    Njia ya malipo:
    Njia ya usafirishaji:
    Jamii Jamii:
    VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Jiwe la msingi - Ingiza, Vituo vya umeme - Viunganishi vya waya wa Magnetic, Viunganisho vya FFC, FPC (Flat Flexible), Viunga vya Nguvu za Aina ya Blade, Viunganisho vya kuvutia - Nyumba, Viunga vya Kumbukumbu - Kadi za PC - Adapta, Viungio vya kawaida - Nyumba za kuziba and Mawasiliano - Kusudi Mbadala ...
    Faida ya Ushindani:
    We specialize in Molex 2010213266 electronic components. 2010213266 can be shipped within 24 hours after order. If you have any demands for 2010213266, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    2010213266 Sifa za Bidhaa

    Nambari ya Sehemu : 2010213266
    Mzalishaji : Molex
    Maelezo : CONN HEADER R/A 16POS 1.27MM
    Mfululizo : Slim-Grid 201021
    Hali ya Sehemu : Active
    Aina ya kiunganishi : Header
    Aina ya Mawasiliano : Male Pin
    Pitch - Mating : 0.050" (1.27mm)
    Idadi ya Nafasi : 16
    Idadi ya safu : 2
    Nafasi za Kuweka safu - Mating : 0.050" (1.27mm)
    Idadi ya Nafasi Zilizopakiwa : All
    Mtindo : Board to Board
    Kunyoa : Shrouded - 4 Wall
    Aina ya Kuinua : Through Hole, Right Angle
    Kukomesha : Solder
    Aina ya kufunga : Latch Holder
    Urefu wa Mawasiliano - Mating : 0.120" (3.05mm)
    Urefu wa Mawasiliano - Chapisho : 0.063" (1.60mm)
    Urefu wa Mawasiliano kwa jumla : -
    Urefu wa insulation : 0.213" (5.40mm)
    Wasiliana na Shape : Square
    Wasiliana Nimalize - Mating : Gold
    Wasiliana na Maliza Kukomesha - Mating : 30.0µin (0.76µm)
    Wasiliana na Maliza - Chapisha : Tin
    Wasiliana na Nyenzo : Copper Alloy
    Nyenzo ya Insulation : Liquid Crystal Polymer (LCP), Glass Filled
    Vipengele : Board Guide, Pick and Place
    Joto la Kufanya kazi : -55°C ~ 105°C
    Ulinzi wa Ingress : -
    Ukosefu wa nguvu wa nyenzo : UL94 V-0
    Rangi ya insulation : Black
    Ukadiriaji wa sasa : -
    Upimaji wa Voltage : 125V

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