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Ikiwa eneo lako halijaorodheshwa, tafadhali chagua moja ya yafuatayo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Nyumbani
  2. Bidhaa
  3. Viungio, Viunganisho
  4. Soketi kwa ICs, Transistors
  5. 36-6573-11

Aries Electronics - 36-6573-11

KEY Part #: K3349298

36-6573-11 Bei (USD) [4634pcs Hisa]

  • 1 pcs$9.39381
  • 4 pcs$9.34708
Nambari ya Sehemu:
36-6573-11
Mzalishaji:
Aries Electronics
Maelezo ya kina:
CONN IC DIP SOCKET ZIF 36POS TIN. IC & Component Sockets QUICK RELEASE 36 PIN GOLD
Manufacturer's standard lead time:
Katika hisa
Maisha ya rafu:
Mwaka mmoja
Chip Kutoka:
Hong Kong
RoHS:
Njia ya malipo:
Njia ya usafirishaji:
Jamii Jamii:
VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Viunganisho vya Kuunganika - Bodi In, moja kwa moj, Viungio vya Uingilio wa Nguvu - Vidonge, Viunganisho vya FFC, FPC (Flat Flexible), Viunga vya Eddi ya Kadi - Anwani, Vituo - Vituo, Viunga vya Banana na Tip - Adapta, Viunganisho vinavyoonekana - Vituo and Pipa - Viungio vya Nguvu ...
Faida ya Ushindani:
We specialize in Aries Electronics 36-6573-11 electronic components. 36-6573-11 can be shipped within 24 hours after order. If you have any demands for 36-6573-11, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

36-6573-11 Sifa za Bidhaa

Nambari ya Sehemu : 36-6573-11
Mzalishaji : Aries Electronics
Maelezo : CONN IC DIP SOCKET ZIF 36POS TIN
Mfululizo : 57
Hali ya Sehemu : Active
Chapa : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Idadi ya Nafasi au Pini (Gridi) : 36 (2 x 18)
Pitch - Mating : 0.100" (2.54mm)
Wasiliana Nimalize - Mating : Tin
Wasiliana na Maliza Kukomesha - Mating : 200.0µin (5.08µm)
Wasiliana na Nyenzo - Mating : Beryllium Copper
Aina ya Kuinua : Through Hole
Vipengele : Closed Frame
Kukomesha : Solder
Shimo - Chapisho : 0.100" (2.54mm)
Wasiliana na Maliza - Chapisha : Tin
Wasiliana na Maliza Kukomesha - Tuma : 200.0µin (5.08µm)
Nyenzo ya Mawasiliano - Chapisha : Beryllium Copper
Nyenzo ya Nyumba : Polyphenylene Sulfide (PPS), Glass Filled
Joto la Kufanya kazi : -
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