Laird Technologies - Thermal Materials - A10463-01

KEY Part #: K6153067

A10463-01 Bei (USD) [9398pcs Hisa]

  • 1 pcs$4.25716
  • 10 pcs$4.14082
  • 25 pcs$3.91077
  • 50 pcs$3.68073
  • 100 pcs$3.45068
  • 250 pcs$3.22064
  • 500 pcs$2.99059
  • 1,000 pcs$2.93308

Nambari ya Sehemu:
A10463-01
Mzalishaji:
Laird Technologies - Thermal Materials
Maelezo ya kina:
THERM PAD 457.2MMX304.8MM GRAY. Thermal Interface Products Tgon 810 A0 12x18" sheet
Manufacturer's standard lead time:
Katika hisa
Maisha ya rafu:
Mwaka mmoja
Chip Kutoka:
Hong Kong
RoHS:
Njia ya malipo:
Njia ya usafirishaji:
Jamii Jamii:
VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Mafuta - Pedi, Karatasi, Mashabiki wa DC, Mafuta - Thermoelectric, Peltier Assemblies, Thermal - Adhesives, Mioyo, Grisi, ladha, Mafuta - baridi ya vinywaji, Mafuta - vifaa, Mafuta - Mabomba ya joto, Chumba cha Vapor and Mashabiki - Vifaa ...
Faida ya Ushindani:
We specialize in Laird Technologies - Thermal Materials A10463-01 electronic components. A10463-01 can be shipped within 24 hours after order. If you have any demands for A10463-01, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

A10463-01 Sifa za Bidhaa

Nambari ya Sehemu : A10463-01
Mzalishaji : Laird Technologies - Thermal Materials
Maelezo : THERM PAD 457.2MMX304.8MM GRAY
Mfululizo : Tgon™ 810
Hali ya Sehemu : Active
Matumizi : -
Chapa : Pad, Sheet
Sura : Rectangular
Muhtasari : 457.20mm x 304.80mm
Unene : 0.0100" (0.254mm)
Nyenzo : Graphite
Adhesive : -
Kuunga mkono, Mtoaji : -
Rangi : Gray
Resisization ya mafuta : 0.10°C/W
Hali ya Mafuta : 5.0 W/m-K

Unaweza pia Kuvutiwa Na
  • PL-2-3-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Green

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-220

    Wakefield-Vette

    THERM PAD 17.78MMX12.7MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, 0.003 Inch Thick

  • CD-02-05-220-N

    Wakefield-Vette

    THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole

  • CD-02-05-247-N

    Wakefield-Vette

    THERM PAD TO-247 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-247 Pad, No Hole

  • CD-02-05-025

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, 1 Inch x 1 Inch Square Pad, 0.003 Inch Thick