Nambari ya Sehemu :
SMDLTLFP250T4
Mzalishaji :
Chip Quik Inc.
Maelezo :
SOLDER PASTE LOW TEMP T4 250G
Muundo :
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Kiwango cha kuyeyuka :
281°F (138°C)
Fomu :
Jar, 8.8 oz (250g)
Maisha ya rafu :
6 Months, 2 Months
Kuanza Maisha ya Rafu :
Date of Manufacture
Joto la Kuhifadhi / Jokofu :
37°F ~ 46°F (3°C ~ 8°C)