DILB32P-223TLF Bei (USD) [194835pcs Hisa]
- 1 pcs$0.18984
- 10,800 pcs$0.07555
- Nambari ya Sehemu:
- DILB32P-223TLF
- Mzalishaji:
- Amphenol ICC (FCI)
- Maelezo ya kina:
- CONN IC DIP SOCKET 32POS TINLEAD. IC & Component Sockets SOCKETS DIP
- Manufacturer's standard lead time:
- Katika hisa
- Maisha ya rafu:
- Mwaka mmoja
- Chip Kutoka:
- Hong Kong
- RoHS:
- Njia ya malipo:
-
- Njia ya usafirishaji:
- Jamii Jamii:
- VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Mifumo ya Jumuia la terminal, D-Sub, Viunganisho vya D-Maumbo - Vikaratasi, Viunga vya nyuma ya nyuma - ARINC, Vituo - Adapta, Viunganisho vya kuvutia - Kunyongwa Bure, Mlima wa, Vitalu vya terminal - Waya kwa Bodi, USB, DVI, Viunganishi vya HDMI - Adapta and Vitalu vya terminal - Moduli za Maingiliano ...
- Faida ya Ushindani:
- We specialize in Amphenol ICC (FCI) DILB32P-223TLF electronic components. DILB32P-223TLF can be shipped within 24 hours after order. If you have any demands for DILB32P-223TLF, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
DILB32P-223TLF Sifa za Bidhaa
Nambari ya Sehemu :
DILB32P-223TLF
Mzalishaji :
Amphenol ICC (FCI)
Maelezo :
CONN IC DIP SOCKET 32POS TINLEAD
Mfululizo :
DILB
Hali ya Sehemu :
Active
Chapa :
DIP, 0.6" (15.24mm) Row Spacing
Idadi ya Nafasi au Pini (Gridi) :
32 (2 x 16)
Pitch - Mating :
0.100" (2.54mm)
Wasiliana Nimalize - Mating :
Tin-Lead
Wasiliana na Maliza Kukomesha - Mating :
100.0µin (2.54µm)
Wasiliana na Nyenzo - Mating :
Copper Alloy
Aina ya Kuinua :
Through Hole
Vipengele :
Open Frame
Kukomesha :
Solder
Shimo - Chapisho :
0.100" (2.54mm)
Wasiliana na Maliza - Chapisha :
Tin-Lead
Wasiliana na Maliza Kukomesha - Tuma :
100.0µin (2.54µm)
Nyenzo ya Mawasiliano - Chapisha :
Copper Alloy
Nyenzo ya Nyumba :
Polyamide (PA), Nylon
Joto la Kufanya kazi :
-55°C ~ 125°C
Habari mpya kabisa
Unaweza pia Kuvutiwa Na
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