Parker Chomerics - 60-12-4659-T500

KEY Part #: K6153125

60-12-4659-T500 Bei (USD) [48206pcs Hisa]

  • 1 pcs$0.81111

Nambari ya Sehemu:
60-12-4659-T500
Mzalishaji:
Parker Chomerics
Maelezo ya kina:
CHO-THERM T500 DO-4 0.010 ADH.
Manufacturer's standard lead time:
Katika hisa
Maisha ya rafu:
Mwaka mmoja
Chip Kutoka:
Hong Kong
RoHS:
Njia ya malipo:
Njia ya usafirishaji:
Jamii Jamii:
VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Mashabiki wa DC, Mafuta - Thermoelectric, Model za Peltier, Mafuta - Pedi, Karatasi, Thermal - Adhesives, Mioyo, Grisi, ladha, Mafuta - baridi ya vinywaji, Mashabiki - Vifaa, Mashabiki - Vifunguo - Kamba za Mashabiki and Mashabiki wa AC ...
Faida ya Ushindani:
We specialize in Parker Chomerics 60-12-4659-T500 electronic components. 60-12-4659-T500 can be shipped within 24 hours after order. If you have any demands for 60-12-4659-T500, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

60-12-4659-T500 Sifa za Bidhaa

Nambari ya Sehemu : 60-12-4659-T500
Mzalishaji : Parker Chomerics
Maelezo : CHO-THERM T500 DO-4 0.010 ADH
Mfululizo : CHO-THERM® T500
Hali ya Sehemu : Active
Matumizi : DO-4
Chapa : Insulator Pad, Sheet
Sura : Round
Muhtasari : 15.88mm Dia
Unene : 0.0100" (0.254mm)
Nyenzo : -
Adhesive : Adhesive - One Side
Kuunga mkono, Mtoaji : Fiberglass
Rangi : Green
Resisization ya mafuta : -
Hali ya Mafuta : 2.1 W/m-K
Unaweza pia Kuvutiwa Na
  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-220

    Wakefield-Vette

    THERM PAD 17.78MMX12.7MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, 0.003 Inch Thick

  • CD-02-05-220-N

    Wakefield-Vette

    THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole

  • CD-02-05-C-22

    Wakefield-Vette

    THERM PAD 0.846 X 0.846. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.846 Inch x 0.846 Inch, No Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole