Laird Technologies - Thermal Materials - OTH-Q81771C-00-DN5

KEY Part #: K6153183

OTH-Q81771C-00-DN5 Bei (USD) [564878pcs Hisa]

  • 1 pcs$0.20050
  • 9 pcs$0.19951
  • 18 pcs$0.18984
  • 27 pcs$0.18032
  • 63 pcs$0.17559
  • 225 pcs$0.17323
  • 450 pcs$0.16136
  • 900 pcs$0.15187

Nambari ya Sehemu:
OTH-Q81771C-00-DN5
Mzalishaji:
Laird Technologies - Thermal Materials
Maelezo ya kina:
THERM PAD 10MMX10MM GRAY.
Manufacturer's standard lead time:
Katika hisa
Maisha ya rafu:
Mwaka mmoja
Chip Kutoka:
Hong Kong
RoHS:
Njia ya malipo:
Njia ya usafirishaji:
Jamii Jamii:
VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Mafuta - Thermoelectric, Peltier Assemblies, Thermal - Adhesives, Mioyo, Grisi, ladha, Mafuta - baridi ya vinywaji, Mashabiki wa DC, Mafuta - vifaa, Mafuta - Thermoelectric, Model za Peltier, Mafuta - Inafuta joto and Mafuta - Mabomba ya joto, Chumba cha Vapor ...
Faida ya Ushindani:
We specialize in Laird Technologies - Thermal Materials OTH-Q81771C-00-DN5 electronic components. OTH-Q81771C-00-DN5 can be shipped within 24 hours after order. If you have any demands for OTH-Q81771C-00-DN5, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

OTH-Q81771C-00-DN5 Sifa za Bidhaa

Nambari ya Sehemu : OTH-Q81771C-00-DN5
Mzalishaji : Laird Technologies - Thermal Materials
Maelezo : THERM PAD 10MMX10MM GRAY
Mfululizo : Tpcm™ 580
Hali ya Sehemu : Active
Matumizi : -
Chapa : Phase Change Pad, Sheet
Sura : Square
Muhtasari : 10.00mm x 10.00mm
Unene : 0.0080" (0.203mm)
Nyenzo : Phase Change Compound
Adhesive : Tacky - Both Sides
Kuunga mkono, Mtoaji : -
Rangi : Gray
Resisization ya mafuta : -
Hali ya Mafuta : 3.8 W/m-K

Unaweza pia Kuvutiwa Na
  • PL-2-1-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole

  • PL-2-5-254-H

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft