ATS-09C-84-C2-R0 Bei (USD) [14431pcs Hisa]
- 1 pcs$2.85574
- 10 pcs$2.63759
- 30 pcs$2.49128
- 50 pcs$2.34470
- 100 pcs$2.19812
- 250 pcs$2.05158
- 500 pcs$1.90504
- 1,000 pcs$1.86840
- Nambari ya Sehemu:
- ATS-09C-84-C2-R0
- Mzalishaji:
- Advanced Thermal Solutions Inc.
- Maelezo ya kina:
- HEATSINK 30X30X35MM R-TAB T766.
- Manufacturer's standard lead time:
- Katika hisa
- Maisha ya rafu:
- Mwaka mmoja
- Chip Kutoka:
- Hong Kong
- RoHS:
- Njia ya malipo:
-
- Njia ya usafirishaji:
- Jamii Jamii:
- VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Mafuta - baridi ya vinywaji, Thermal - Adhesives, Mioyo, Grisi, ladha, Mafuta - Pedi, Karatasi, Mashabiki wa DC, Mashabiki - Vifaa, Mafuta - Thermoelectric, Model za Peltier, Mafuta - Mabomba ya joto, Chumba cha Vapor and Mafuta - Inafuta joto ...
- Faida ya Ushindani:
- We specialize in Advanced Thermal Solutions Inc. ATS-09C-84-C2-R0 electronic components. ATS-09C-84-C2-R0 can be shipped within 24 hours after order. If you have any demands for ATS-09C-84-C2-R0, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
ATS-09C-84-C2-R0 Sifa za Bidhaa
Nambari ya Sehemu :
ATS-09C-84-C2-R0
Mzalishaji :
Advanced Thermal Solutions Inc.
Maelezo :
HEATSINK 30X30X35MM R-TAB T766
Mfululizo :
pushPIN™
Hali ya Sehemu :
Active
Chapa :
Top Mount
Kifurushi kilichopozwa :
Assorted (BGA, LGA, CPU, ASIC...)
Njia ya Kiambatisho :
Push Pin
Sura :
Square, Fins
Urefu :
1.181" (30.00mm)
Upana :
1.181" (30.00mm)
Kipenyo :
-
Urefu Mbali Msingi (Urefu wa Fin) :
1.378" (35.00mm)
Uondoaji wa Nguvu @ Joto la joto :
-
Upinzani wa mafuta @ Uliyolazimishwa Kutoka Hewa :
7.00°C/W @ 100 LFM
Upinzani wa mafuta @ Asili :
-
Nyenzo :
Aluminum
Maliza ya Maliza :
Blue Anodized
Habari mpya kabisa
Unaweza pia Kuvutiwa Na
-
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511-6U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x152.4mm
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511-12U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x304.8mm
-
-
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