JAE Electronics - FI-SE30P-HFE-E3000

KEY Part #: K1374335

[8869pcs Hisa]


    Nambari ya Sehemu:
    FI-SE30P-HFE-E3000
    Mzalishaji:
    JAE Electronics
    Maelezo ya kina:
    CONN HEADER SMD R/A 30POS 1.25MM.
    Manufacturer's standard lead time:
    Katika hisa
    Maisha ya rafu:
    Mwaka mmoja
    Chip Kutoka:
    Hong Kong
    RoHS:
    Njia ya malipo:
    Njia ya usafirishaji:
    Jamii Jamii:
    VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Viungio vya mviringo - Nyumba, Vituo - Nyumba, buti, Viunganishi vya Kawaida - Jacks Pamoja na Sumaku, Vitalu vya terminal - Vifuniko - Wire Ferrules, Viunga vya Eddi ya Kadi - Anwani, Vitalu vya terminal - Moduli za Maingiliano, Viunga vya Backplane - DIN 41612 and Viungio vya msimu - Vitalu vya Wiring - Vifuniko ...
    Faida ya Ushindani:
    We specialize in JAE Electronics FI-SE30P-HFE-E3000 electronic components. FI-SE30P-HFE-E3000 can be shipped within 24 hours after order. If you have any demands for FI-SE30P-HFE-E3000, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    FI-SE30P-HFE-E3000 Sifa za Bidhaa

    Nambari ya Sehemu : FI-SE30P-HFE-E3000
    Mzalishaji : JAE Electronics
    Maelezo : CONN HEADER SMD R/A 30POS 1.25MM
    Mfululizo : FI
    Hali ya Sehemu : Obsolete
    Aina ya kiunganishi : Receptacle
    Aina ya Mawasiliano : Male Pin
    Pitch - Mating : 0.049" (1.25mm)
    Idadi ya Nafasi : 30
    Idadi ya safu : 1
    Nafasi za Kuweka safu - Mating : -
    Idadi ya Nafasi Zilizopakiwa : All
    Mtindo : Board to Cable/Wire
    Kunyoa : Shrouded - 4 Wall
    Aina ya Kuinua : Surface Mount, Right Angle
    Kukomesha : Solder
    Aina ya kufunga : Friction Lock
    Urefu wa Mawasiliano - Mating : -
    Urefu wa Mawasiliano - Chapisho : -
    Urefu wa Mawasiliano kwa jumla : -
    Urefu wa insulation : 0.083" (2.10mm)
    Wasiliana na Shape : Square
    Wasiliana Nimalize - Mating : Gold
    Wasiliana na Maliza Kukomesha - Mating : -
    Wasiliana na Maliza - Chapisha : Tin or Tin-Alloy
    Wasiliana na Nyenzo : Copper Alloy
    Nyenzo ya Insulation : Liquid Crystal Polymer (LCP), Glass Filled
    Vipengele : Shielded, Solder Retention
    Joto la Kufanya kazi : -40°C ~ 80°C
    Ulinzi wa Ingress : -
    Ukosefu wa nguvu wa nyenzo : UL94 V-0
    Rangi ya insulation : Beige
    Ukadiriaji wa sasa : 1A per Contact
    Upimaji wa Voltage : 200V

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