Amphenol ICC (Commercial Products) - G881A20001TEU

KEY Part #: K1759246

G881A20001TEU Bei (USD) [99226pcs Hisa]

  • 1 pcs$0.44477
  • 1,980 pcs$0.44256

Nambari ya Sehemu:
G881A20001TEU
Mzalishaji:
Amphenol ICC (Commercial Products)
Maelezo ya kina:
CONN HEADER R/A 20POS 3MM. Power to the Board MicroPwrR/A20pinLCP tin 100u
Manufacturer's standard lead time:
Katika hisa
Maisha ya rafu:
Mwaka mmoja
Chip Kutoka:
Hong Kong
RoHS:
Njia ya malipo:
Njia ya usafirishaji:
Jamii Jamii:
VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Vitalu vya terminal - Vifuniko - Wire Ferrules, Soketi kwa ICs, Transistors - Vifuniko, Vituo - Solder Lug Viunga, Jiwe la msingi - Viwambo, fremu, Viunganisho vya kuvutia - Kunyongwa Bure, Mlima wa, Viunga vya Kumbukumbu - Soketi za Moduli za Inline, Viunganisho vya Kawaida - Vidonge and Pipa - Viungio vya Nguvu ...
Faida ya Ushindani:
We specialize in Amphenol ICC (Commercial Products) G881A20001TEU electronic components. G881A20001TEU can be shipped within 24 hours after order. If you have any demands for G881A20001TEU, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

G881A20001TEU Sifa za Bidhaa

Nambari ya Sehemu : G881A20001TEU
Mzalishaji : Amphenol ICC (Commercial Products)
Maelezo : CONN HEADER R/A 20POS 3MM
Mfululizo : Micro Power
Hali ya Sehemu : Active
Aina ya kiunganishi : Header
Aina ya Mawasiliano : Male Pin
Pitch - Mating : 0.118" (3.00mm)
Idadi ya Nafasi : 20
Idadi ya safu : 2
Nafasi za Kuweka safu - Mating : 0.118" (3.00mm)
Idadi ya Nafasi Zilizopakiwa : All
Mtindo : Board to Cable/Wire
Kunyoa : Shrouded - 4 Wall
Aina ya Kuinua : Through Hole, Right Angle
Kukomesha : Solder
Aina ya kufunga : Locking Ramp
Urefu wa Mawasiliano - Mating : -
Urefu wa Mawasiliano - Chapisho : 0.126" (3.20mm)
Urefu wa Mawasiliano kwa jumla : -
Urefu wa insulation : 0.268" (6.80mm)
Wasiliana na Shape : Square
Wasiliana Nimalize - Mating : Tin
Wasiliana na Maliza Kukomesha - Mating : 100.0µin (2.54µm)
Wasiliana na Maliza - Chapisha : Tin
Wasiliana na Nyenzo : Copper Alloy
Nyenzo ya Insulation : Liquid Crystal Polymer (LCP)
Vipengele : Board Lock
Joto la Kufanya kazi : -
Ulinzi wa Ingress : -
Ukosefu wa nguvu wa nyenzo : UL94 V-0
Rangi ya insulation : Black
Ukadiriaji wa sasa : -
Upimaji wa Voltage : -

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