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Ikiwa eneo lako halijaorodheshwa, tafadhali chagua moja ya yafuatayo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Nyumbani
  2. Bidhaa
  3. Viungio, Viunganisho
  4. Soketi kwa ICs, Transistors
  5. 32-6554-18

Aries Electronics - 32-6554-18

KEY Part #: K3342852

32-6554-18 Bei (USD) [1214pcs Hisa]

  • 1 pcs$35.85887
  • 8 pcs$35.68047
Nambari ya Sehemu:
32-6554-18
Mzalishaji:
Aries Electronics
Maelezo ya kina:
CONN IC DIP SOCKET ZIF 32POS. IC & Component Sockets FORCE DIP TEST SCKT HIGH TEMP 32 PINS
Manufacturer's standard lead time:
Katika hisa
Maisha ya rafu:
Mwaka mmoja
Chip Kutoka:
Hong Kong
RoHS:
Njia ya malipo:
Njia ya usafirishaji:
Jamii Jamii:
VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Vituo - Viunganishi vya kisu, Viungio vya msimu - Vitalu vya Wiring - Vifuniko, Viunganisho vya kuvutia - Nyumba, Vituo - Viungio vya Spoti, Viunga vya Kuingilia Nguvu - Vidonge, Vidonge, Mod, Vitalu vya terminal - Mawasiliano, Vituo - Viunganishi vya Screw and Waunganishaji wa Taa za Jimbo Mango ...
Faida ya Ushindani:
We specialize in Aries Electronics 32-6554-18 electronic components. 32-6554-18 can be shipped within 24 hours after order. If you have any demands for 32-6554-18, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

32-6554-18 Sifa za Bidhaa

Nambari ya Sehemu : 32-6554-18
Mzalishaji : Aries Electronics
Maelezo : CONN IC DIP SOCKET ZIF 32POS
Mfululizo : 55
Hali ya Sehemu : Active
Chapa : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Idadi ya Nafasi au Pini (Gridi) : 32 (2 x 16)
Pitch - Mating : 0.100" (2.54mm)
Wasiliana Nimalize - Mating : Nickel Boron
Wasiliana na Maliza Kukomesha - Mating : 50.0µin (1.27µm)
Wasiliana na Nyenzo - Mating : Beryllium Nickel
Aina ya Kuinua : Through Hole
Vipengele : Closed Frame
Kukomesha : Solder
Shimo - Chapisho : 0.100" (2.54mm)
Wasiliana na Maliza - Chapisha : Nickel Boron
Wasiliana na Maliza Kukomesha - Tuma : 50.0µin (1.27µm)
Nyenzo ya Mawasiliano - Chapisha : Beryllium Nickel
Nyenzo ya Nyumba : Polyetheretherketone (PEEK), Glass Filled
Joto la Kufanya kazi : -55°C ~ 250°C
Unaweza pia Kuvutiwa Na
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    CONN SOCKET PGA ZIF GOLD.

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    CONN SOCKET QFN 32POS GOLD. IC & Component Sockets Textool QFN .5MM,32P EVEN ROW,W/THRML PIN

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    CONN SOCKET QFN 28POS GOLD. IC & Component Sockets Textool QFN .5MM,28P ODD ROW, W/THRML PIN

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    CONN SOCKET QFN 24POS GOLD. IC & Component Sockets Textool QFN .5MM,24P EVEN ROW,W/THRML PIN

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