Nambari ya Sehemu :
212-1-18-003
Maelezo :
CONN IC DIP SOCKET 18POS GOLD
Chapa :
DIP, 0.3" (7.62mm) Row Spacing
Idadi ya Nafasi au Pini (Gridi) :
18 (2 x 9)
Pitch - Mating :
0.100" (2.54mm)
Wasiliana Nimalize - Mating :
Gold
Wasiliana na Maliza Kukomesha - Mating :
-
Wasiliana na Nyenzo - Mating :
Beryllium Copper
Aina ya Kuinua :
Surface Mount
Shimo - Chapisho :
0.100" (2.54mm)
Wasiliana na Maliza - Chapisha :
Tin
Wasiliana na Maliza Kukomesha - Tuma :
200.0µin (5.08µm)
Nyenzo ya Mawasiliano - Chapisha :
Brass
Nyenzo ya Nyumba :
Polybutylene Terephthalate (PBT)
Joto la Kufanya kazi :
-40°C ~ 105°C