Nambari ya Sehemu :
XR2A-0811-N
Mzalishaji :
Omron Electronics Inc-EMC Div
Maelezo :
CONN IC DIP SOCKET 8POS GOLD
Chapa :
DIP, 0.3" (7.62mm) Row Spacing
Idadi ya Nafasi au Pini (Gridi) :
8 (2 x 4)
Pitch - Mating :
0.100" (2.54mm)
Wasiliana Nimalize - Mating :
Gold
Wasiliana na Maliza Kukomesha - Mating :
10.0µin (0.25µm)
Wasiliana na Nyenzo - Mating :
Beryllium Copper
Aina ya Kuinua :
Through Hole
Shimo - Chapisho :
0.100" (2.54mm)
Wasiliana na Maliza - Chapisha :
Gold
Wasiliana na Maliza Kukomesha - Tuma :
10.0µin (0.25µm)
Nyenzo ya Mawasiliano - Chapisha :
Beryllium Copper
Nyenzo ya Nyumba :
Polybutylene Terephthalate (PBT), Glass Filled
Joto la Kufanya kazi :
-55°C ~ 125°C