3M - 290-1294-00-3302J

KEY Part #: K3343900

290-1294-00-3302J Bei (USD) [2007pcs Hisa]

  • 1 pcs$20.54272
  • 10 pcs$19.33258
  • 25 pcs$18.72844
  • 50 pcs$17.52015
  • 100 pcs$16.55352
  • 250 pcs$16.07021

Nambari ya Sehemu:
290-1294-00-3302J
Mzalishaji:
3M
Maelezo ya kina:
CONN IC DIP SOCKET ZIF 90POS GLD. IC & Component Sockets 0.070" DIP SOCKET 90 Contact Qty.
Manufacturer's standard lead time:
Katika hisa
Maisha ya rafu:
Mwaka mmoja
Chip Kutoka:
Hong Kong
RoHS:
Njia ya malipo:
Njia ya usafirishaji:
Jamii Jamii:
VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Viungio vya kawaida - Jacks, Vituo - Viunganishi vya Mtaa, Viungio vya mviringo - Anwani, Viungio vya mviringo - Nyumba, Viunganishi vya Eddi ya Kadi - Vituo, Viungio vya mviringo, Viunga vya Ushuru mzito - Nyumba, Hoods, Bases and Viungio vya Coaxial (RF) ...
Faida ya Ushindani:
We specialize in 3M 290-1294-00-3302J electronic components. 290-1294-00-3302J can be shipped within 24 hours after order. If you have any demands for 290-1294-00-3302J, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

290-1294-00-3302J Sifa za Bidhaa

Nambari ya Sehemu : 290-1294-00-3302J
Mzalishaji : 3M
Maelezo : CONN IC DIP SOCKET ZIF 90POS GLD
Mfululizo : Textool™
Hali ya Sehemu : Active
Chapa : DIP, ZIF (ZIP)
Idadi ya Nafasi au Pini (Gridi) : 90 (2 x 45)
Pitch - Mating : 0.070" (1.78mm)
Wasiliana Nimalize - Mating : Gold
Wasiliana na Maliza Kukomesha - Mating : 30.0µin (0.76µm)
Wasiliana na Nyenzo - Mating : Beryllium Copper
Aina ya Kuinua : Through Hole
Vipengele : Closed Frame
Kukomesha : Solder
Shimo - Chapisho : 0.070" (1.78mm)
Wasiliana na Maliza - Chapisha : Gold
Wasiliana na Maliza Kukomesha - Tuma : 30.0µin (0.76µm)
Nyenzo ya Mawasiliano - Chapisha : Beryllium Copper
Nyenzo ya Nyumba : Polysulfone (PSU), Glass Filled
Joto la Kufanya kazi : -55°C ~ 125°C

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