Nambari ya Sehemu :
BGM15LBA12E6327XTSA1
Mzalishaji :
Infineon Technologies
Maelezo :
MULTI CHIP MODULES
RF Familia / Kiwango :
Bluetooth
Itifaki :
802.11a/b/g/n, Bluetooth v4.0
Moduleti :
16QAM, 64QAM, 256QAM, DSSS, FHSS, OFDM
Mara kwa mara :
703MHz ~ 960MHz
Kiwango cha data :
54Mbps
Viingiliano vya serial :
SPI, USB
Iliyotumika IC / Sehemu :
-
Voltage - Ugavi :
1.7V ~ 3.1V
Aina ya Kuinua :
Surface Mount
Joto la Kufanya kazi :
-40°C ~ 85°C
Kifurushi / Kesi :
12-UFQFN Exposed Pad