Nambari ya Sehemu :
BU400Z-178-HT
Mzalishaji :
On Shore Technology Inc.
Maelezo :
CONN IC DIP SOCKET 40POS GOLD
Chapa :
DIP, 0.6" (15.24mm) Row Spacing
Idadi ya Nafasi au Pini (Gridi) :
40 (2 x 20)
Pitch - Mating :
0.100" (2.54mm)
Wasiliana Nimalize - Mating :
Gold
Wasiliana na Maliza Kukomesha - Mating :
78.7µin (2.00µm)
Wasiliana na Nyenzo - Mating :
Beryllium Copper
Aina ya Kuinua :
Surface Mount
Shimo - Chapisho :
0.100" (2.54mm)
Wasiliana na Maliza - Chapisha :
Copper
Wasiliana na Maliza Kukomesha - Tuma :
Flash
Nyenzo ya Mawasiliano - Chapisha :
Brass
Nyenzo ya Nyumba :
Polybutylene Terephthalate (PBT), Glass Filled
Joto la Kufanya kazi :
-55°C ~ 125°C