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  1. Nyumbani
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  4. Iliyoingizwa - Mfumo kwenye Chip (SoC)
  5. XCZU11EG-3FFVB1517E

Xilinx Inc. - XCZU11EG-3FFVB1517E

KEY Part #: K1302446

[17pcs Hisa]

    Nambari ya Sehemu:
    XCZU11EG-3FFVB1517E
    Mzalishaji:
    Xilinx Inc.
    Maelezo ya kina:
    IC FPGA 488 I/O 1517FCBGA.
    Manufacturer's standard lead time:
    Katika hisa
    Maisha ya rafu:
    Mwaka mmoja
    Chip Kutoka:
    Hong Kong
    RoHS:
    Njia ya malipo:
    Njia ya usafirishaji:
    Jamii Jamii:
    VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Linear - Usindikaji wa Video, PMIC - Chaja za Batri, Logic - Gates na Inverters, Maingiliano - Swichi za Analog, Multiplexers, Demu, Maelewano - Sensor, Kugusa uwezo, Maingiliano - UARTs (Transformer ya Universal Asyn, Upataji wa data - Potentiometers za dijiti and Maingiliano - Modemu - IC na Moduli ...
    Faida ya Ushindani:
    We specialize in Xilinx Inc. XCZU11EG-3FFVB1517E electronic components. XCZU11EG-3FFVB1517E can be shipped within 24 hours after order. If you have any demands for XCZU11EG-3FFVB1517E, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    XCZU11EG-3FFVB1517E Sifa za Bidhaa

    Nambari ya Sehemu : XCZU11EG-3FFVB1517E
    Mzalishaji : Xilinx Inc.
    Maelezo : IC FPGA 488 I/O 1517FCBGA
    Mfululizo : Zynq® UltraScale+™ MPSoC EG
    Hali ya Sehemu : Active
    Usanifu : MCU, FPGA
    Mchakato wa Core : Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    Ukubwa wa Flash : -
    Saizi ya RAM : 256KB
    Mzunguko : DMA, WDT
    Uunganisho : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Kasi : 600MHz, 667MHz, 1.5GHz
    Sifa za Msingi : Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
    Joto la Kufanya kazi : 0°C ~ 100°C (TJ)
    Kifurushi / Kesi : 1517-BBGA, FCBGA
    Kifurushi cha Kifaa cha Mtoaji : 1517-FCBGA (40x40)

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