t-Global Technology - GP2000-D11-L25-0.3

KEY Part #: K6153168

GP2000-D11-L25-0.3 Bei (USD) [212548pcs Hisa]

  • 1 pcs$0.17402
  • 10 pcs$0.16453
  • 25 pcs$0.15630
  • 50 pcs$0.15219
  • 100 pcs$0.15013
  • 250 pcs$0.13985
  • 500 pcs$0.13162
  • 1,000 pcs$0.11928
  • 5,000 pcs$0.11517

Nambari ya Sehemu:
GP2000-D11-L25-0.3
Mzalishaji:
t-Global Technology
Maelezo ya kina:
THERM PAD 25MMX11MM GREEN.
Manufacturer's standard lead time:
Katika hisa
Maisha ya rafu:
Mwaka mmoja
Chip Kutoka:
Hong Kong
RoHS:
Njia ya malipo:
Njia ya usafirishaji:
Jamii Jamii:
VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Mafuta - vifaa, Mafuta - Thermoelectric, Peltier Assemblies, Mafuta - Inafuta joto, Mafuta - Thermoelectric, Model za Peltier, Mashabiki - Vifaa, Mafuta - baridi ya vinywaji, Thermal - Adhesives, Mioyo, Grisi, ladha and Mafuta - Mabomba ya joto, Chumba cha Vapor ...
Faida ya Ushindani:
We specialize in t-Global Technology GP2000-D11-L25-0.3 electronic components. GP2000-D11-L25-0.3 can be shipped within 24 hours after order. If you have any demands for GP2000-D11-L25-0.3, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

GP2000-D11-L25-0.3 Sifa za Bidhaa

Nambari ya Sehemu : GP2000-D11-L25-0.3
Mzalishaji : t-Global Technology
Maelezo : THERM PAD 25MMX11MM GREEN
Mfululizo : GP2000
Hali ya Sehemu : Active
Matumizi : -
Chapa : Pad, Tube
Sura : Round
Muhtasari : 25.00mm x 11.00mm
Unene : 0.0118" (0.300mm)
Nyenzo : Silicone Rubber
Adhesive : -
Kuunga mkono, Mtoaji : -
Rangi : Green
Resisization ya mafuta : -
Hali ya Mafuta : 1.3 W/m-K

Unaweza pia Kuvutiwa Na
  • PL-2-1-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole

  • PL-2-5-254-H

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft