TFM-130-01-L-D-RE1-WT Bei (USD) [8974pcs Hisa]
- 1 pcs$4.59209
- 10 pcs$4.39202
- 100 pcs$3.69329
- 500 pcs$3.09438
- 1,000 pcs$2.73503
- Nambari ya Sehemu:
- TFM-130-01-L-D-RE1-WT
- Mzalishaji:
- Samtec Inc.
- Maelezo ya kina:
- CONN HEADER R/A 60POS 1.27MM. Headers & Wire Housings .050" Tiger Eye High-Reliability Terminal Strip
- Manufacturer's standard lead time:
- Katika hisa
- Maisha ya rafu:
- Mwaka mmoja
- Chip Kutoka:
- Hong Kong
- RoHS:
- Njia ya malipo:
-
- Njia ya usafirishaji:
- Jamii Jamii:
- VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Viungio vya msimu - Vitalu vya Wiring - Vifuniko, Viunganisho vya kuvutia - Vichwa, pini za Kiume, Viungio vya mviringo - Anwani, Viunga vya Photovoltaic (Solar Panel) - Mawasilian, Viungio vya mviringo - Nyumba, Vituo - Pini ya PC, Viunganisho vya Barua Moja, D-Sub, Viunganisho vya D-Maumbo - Vifuniko and Mawasiliano - Kusudi Mbadala ...
- Faida ya Ushindani:
- We specialize in Samtec Inc. TFM-130-01-L-D-RE1-WT electronic components. TFM-130-01-L-D-RE1-WT can be shipped within 24 hours after order. If you have any demands for TFM-130-01-L-D-RE1-WT, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
TFM-130-01-L-D-RE1-WT Sifa za Bidhaa
Nambari ya Sehemu :
TFM-130-01-L-D-RE1-WT
Mzalishaji :
Samtec Inc.
Maelezo :
CONN HEADER R/A 60POS 1.27MM
Mfululizo :
Tiger Eye™ TFM
Hali ya Sehemu :
Active
Aina ya kiunganishi :
Header, Elevated
Aina ya Mawasiliano :
Male Pin
Pitch - Mating :
0.050" (1.27mm)
Idadi ya Nafasi :
60
Idadi ya safu :
2
Nafasi za Kuweka safu - Mating :
0.050" (1.27mm)
Idadi ya Nafasi Zilizopakiwa :
All
Mtindo :
Board to Board or Cable
Kunyoa :
Shrouded - 4 Wall
Aina ya Kuinua :
Through Hole, Right Angle
Kukomesha :
Solder
Aina ya kufunga :
Push-Pull
Urefu wa Mawasiliano - Mating :
0.139" (3.53mm)
Urefu wa Mawasiliano - Chapisho :
0.078" (1.98mm)
Urefu wa Mawasiliano kwa jumla :
-
Urefu wa insulation :
0.256" (6.50mm)
Wasiliana na Shape :
Square
Wasiliana Nimalize - Mating :
Gold
Wasiliana na Maliza Kukomesha - Mating :
15.0µin (0.38µm)
Wasiliana na Maliza - Chapisha :
Tin
Wasiliana na Nyenzo :
Phosphor Bronze
Nyenzo ya Insulation :
Liquid Crystal Polymer (LCP)
Vipengele :
Solder Retention
Joto la Kufanya kazi :
-55°C ~ 125°C
Ulinzi wa Ingress :
-
Ukosefu wa nguvu wa nyenzo :
UL94 V-0
Rangi ya insulation :
Black
Ukadiriaji wa sasa :
2.9A per Contact
Upimaji wa Voltage :
275VAC
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