Nambari ya Sehemu :
APF30-30-13CB
Mzalishaji :
CTS Thermal Management Products
Maelezo :
HEATSINK LOW-PROFILE FORGED
Kifurushi kilichopozwa :
Assorted (BGA, LGA, CPU, ASIC...)
Njia ya Kiambatisho :
Thermal Tape, Adhesive (Not Included)
Urefu Mbali Msingi (Urefu wa Fin) :
0.500" (12.70mm)
Uondoaji wa Nguvu @ Joto la joto :
-
Upinzani wa mafuta @ Uliyolazimishwa Kutoka Hewa :
2.50°C/W @ 200 LFM
Upinzani wa mafuta @ Asili :
-
Maliza ya Maliza :
Black Anodized