Amphenol ICC (FCI) - DILB18P-223TLF

KEY Part #: K3363434

DILB18P-223TLF Bei (USD) [283397pcs Hisa]

  • 1 pcs$0.13051
  • 15,600 pcs$0.04565

Nambari ya Sehemu:
DILB18P-223TLF
Mzalishaji:
Amphenol ICC (FCI)
Maelezo ya kina:
CONN IC DIP SOCKET 18POS TINLEAD. IC & Component Sockets SOCKETS DIP
Manufacturer's standard lead time:
Katika hisa
Maisha ya rafu:
Mwaka mmoja
Chip Kutoka:
Hong Kong
RoHS:
Njia ya malipo:
Njia ya usafirishaji:
Jamii Jamii:
VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Kati ya Adapta za Mfululizo, Viungio vya Coaxial (RF) - Vifuniko, Viunga vya Photovoltaic (Solar Panel) - Mawasilian, Viunga vya Kumbukumbu - Kadi za PC - Adapta, Vituo - Viungio vya Spoti, Soketi kwa ICs, Transistors - Vifuniko, Viunganisho vya kuvutia - Nyumba and Viunga vya Photovoltaic (Solar Panel) ...
Faida ya Ushindani:
We specialize in Amphenol ICC (FCI) DILB18P-223TLF electronic components. DILB18P-223TLF can be shipped within 24 hours after order. If you have any demands for DILB18P-223TLF, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

DILB18P-223TLF Sifa za Bidhaa

Nambari ya Sehemu : DILB18P-223TLF
Mzalishaji : Amphenol ICC (FCI)
Maelezo : CONN IC DIP SOCKET 18POS TINLEAD
Mfululizo : DILB
Hali ya Sehemu : Active
Chapa : DIP, 0.3" (7.62mm) Row Spacing
Idadi ya Nafasi au Pini (Gridi) : 18 (2 x 9)
Pitch - Mating : 0.100" (2.54mm)
Wasiliana Nimalize - Mating : Tin-Lead
Wasiliana na Maliza Kukomesha - Mating : 100.0µin (2.54µm)
Wasiliana na Nyenzo - Mating : Copper Alloy
Aina ya Kuinua : Through Hole
Vipengele : Open Frame
Kukomesha : Solder
Shimo - Chapisho : 0.100" (2.54mm)
Wasiliana na Maliza - Chapisha : Tin-Lead
Wasiliana na Maliza Kukomesha - Tuma : 100.0µin (2.54µm)
Nyenzo ya Mawasiliano - Chapisha : Copper Alloy
Nyenzo ya Nyumba : Polyamide (PA), Nylon
Joto la Kufanya kazi : -55°C ~ 125°C