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Ikiwa eneo lako halijaorodheshwa, tafadhali chagua moja ya yafuatayo:

polskiSvenskaespañolItaliaFrançaisEnglishDeutschFrançaisItaliaespañolPortuguês日本語한국의русскийMaoričeštinaSlovenskáΕλλάδαDanskEuskeraSuomiromânescíslenskaSvenskaMelayuالعربيةGaeilgeGalegoTürk diliKongeriketRepublika e ShqipërisëБеларусьEesti Vabariikಕನ್ನಡkannaḍalietuviųLatviešuAyitiසිංහලAzərbaycanภาษาไทยनेपालीtiếng ViệtPilipinoსაქართველოCambodiaپښتوТоҷикӣAfrikaansKiswahilimalaɡasʲفارسیతెలుగుpolski
  1. Nyumbani
  2. Bidhaa
  3. Viungio, Viunganisho
  4. Soketi kwa ICs, Transistors
  5. 40-3574-18

Aries Electronics - 40-3574-18

KEY Part #: K3342591

40-3574-18 Bei (USD) [853pcs Hisa]

  • 1 pcs$54.68439
  • 8 pcs$54.41232
Nambari ya Sehemu:
40-3574-18
Mzalishaji:
Aries Electronics
Maelezo ya kina:
CONN IC DIP SOCKET ZIF 40POS GLD. IC & Component Sockets QUICK RELEASE 40 PIN HI TEMP
Manufacturer's standard lead time:
Katika hisa
Maisha ya rafu:
Mwaka mmoja
Chip Kutoka:
Hong Kong
RoHS:
Njia ya malipo:
Njia ya usafirishaji:
Jamii Jamii:
VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Vitalu vya terminal - Usambazaji wa Nguvu, Viunganisho vya kuvutia - Vichwa, pini za Kiume, Viunganisho vya Mtaa-Spacers za Bodi, stika (Bodi , Vituo - Viunganishi vya Mtaa, USB, DVI, Viunganishi vya HDMI - Vifuniko, Viunga vya LGH, Pipa - Vifaa and Vituo - Vinjari vya Turret ...
Faida ya Ushindani:
We specialize in Aries Electronics 40-3574-18 electronic components. 40-3574-18 can be shipped within 24 hours after order. If you have any demands for 40-3574-18, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

40-3574-18 Sifa za Bidhaa

Nambari ya Sehemu : 40-3574-18
Mzalishaji : Aries Electronics
Maelezo : CONN IC DIP SOCKET ZIF 40POS GLD
Mfululizo : 57
Hali ya Sehemu : Active
Chapa : DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Idadi ya Nafasi au Pini (Gridi) : 40 (2 x 20)
Pitch - Mating : 0.100" (2.54mm)
Wasiliana Nimalize - Mating : Gold
Wasiliana na Maliza Kukomesha - Mating : 10.0µin (0.25µm)
Wasiliana na Nyenzo - Mating : Beryllium Copper
Aina ya Kuinua : Through Hole
Vipengele : Closed Frame
Kukomesha : Solder
Shimo - Chapisho : 0.100" (2.54mm)
Wasiliana na Maliza - Chapisha : Gold
Wasiliana na Maliza Kukomesha - Tuma : 10.0µin (0.25µm)
Nyenzo ya Mawasiliano - Chapisha : Beryllium Copper
Nyenzo ya Nyumba : Polyphenylene Sulfide (PPS), Glass Filled
Joto la Kufanya kazi : -
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