Nambari ya Sehemu :
FI-XPB30SRL-HF11
Mzalishaji :
JAE Electronics
Maelezo :
CONN RCPT 30P 0.039 GOLD SMD R/A
Hali ya Sehemu :
Obsolete
Aina ya kiunganishi :
Receptacle
Aina ya Mawasiliano :
Non-Gendered
Mtindo :
Board to Cable/Wire
Idadi ya Nafasi Zilizopakiwa :
All
Pitch - Mating :
0.039" (1.00mm)
Nafasi za Kuweka safu - Mating :
-
Aina ya Kuinua :
Board Edge, Cutout; Bottom Mount, Surface Mount, Right Angle, Reverse Mount
Aina ya kufunga :
Friction Lock
Wasiliana Nimalize - Mating :
Gold
Wasiliana na Maliza Kukomesha - Mating :
12.0µin (0.30µm)
Rangi ya insulation :
Black
Urefu wa Mawasiliano - Chapisho :
-
Ukosefu wa nguvu wa nyenzo :
UL94 V-0
Wasiliana na Maliza - Chapisha :
Tin
Urefu wa Kuingiliana kwa urefu :
-
Vipengele :
Grounding Pins, Shielded, Solder Retention