ESQT-105-02-F-S-587 Bei (USD) [61934pcs Hisa]
- 1 pcs$0.63133
- Nambari ya Sehemu:
- ESQT-105-02-F-S-587
- Mzalishaji:
- Samtec Inc.
- Maelezo ya kina:
- CONN SOCKET 5POS 0.079 GOLD PCB.
- Manufacturer's standard lead time:
- Katika hisa
- Maisha ya rafu:
- Mwaka mmoja
- Chip Kutoka:
- Hong Kong
- RoHS:
- Njia ya malipo:
-
- Njia ya usafirishaji:
- Jamii Jamii:
- VITAMBUZI VYA Co, LTD ni Msambazaji wa Vipengele vya Elektroniki ambavyo hutoa aina za bidhaa pamoja na: Viunganisho vya D-Sub, Viunga vya nyuma vya nyuma - Vikuni, Viunga vya Banana na Tip - Adapta, Viunganisho vya kuvutia - Vichwa, Vituo, Soketi za, Vituo - Nyumba, buti, Viunganisho vya kuvutia - Nyumba, Viunganisho vya kuvutia - Kunyongwa Bure, Mlima wa and Viunganisho vya Mtaa-Spacers za Bodi, stika (Bodi ...
- Faida ya Ushindani:
- We specialize in Samtec Inc. ESQT-105-02-F-S-587 electronic components. ESQT-105-02-F-S-587 can be shipped within 24 hours after order. If you have any demands for ESQT-105-02-F-S-587, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
ESQT-105-02-F-S-587 Sifa za Bidhaa
Nambari ya Sehemu :
ESQT-105-02-F-S-587
Mzalishaji :
Samtec Inc.
Maelezo :
CONN SOCKET 5POS 0.079 GOLD PCB
Mfululizo :
ESQT
Hali ya Sehemu :
Active
Aina ya kiunganishi :
Elevated Socket
Aina ya Mawasiliano :
Forked
Mtindo :
Board to Board or Cable
Idadi ya Nafasi :
5
Idadi ya Nafasi Zilizopakiwa :
All
Pitch - Mating :
0.079" (2.00mm)
Idadi ya safu :
1
Nafasi za Kuweka safu - Mating :
-
Aina ya Kuinua :
Through Hole
Kukomesha :
Solder
Aina ya kufunga :
Push-Pull
Wasiliana Nimalize - Mating :
Gold
Wasiliana na Maliza Kukomesha - Mating :
3.00µin (0.076µm)
Rangi ya insulation :
Black
Urefu wa insulation :
0.587" (14.91mm)
Urefu wa Mawasiliano - Chapisho :
0.263" (6.68mm)
Joto la Kufanya kazi :
-55°C ~ 125°C
Ukosefu wa nguvu wa nyenzo :
UL94 V-0
Wasiliana na Maliza - Chapisha :
Tin
Urefu wa Kuingiliana kwa urefu :
-
Ulinzi wa Ingress :
-
Vipengele :
-
Ukadiriaji wa sasa :
4.5A per Contact
Upimaji wa Voltage :
-
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